Diamond wire is the most interesting innovation in the field of diamond cutting tools. with its high precision, quick speed & high efficiency, In constant growth, wire is used in hard and brittle materials, as well as very thin wafers, such as silicon, sapphire, magnetic materials and advanced ceramic materials, etc.

Technology: electroplated

Specifications available: φ50um-φ 450um

Applications: PV, LED, consumer electronics and precision optical instrument etc.

Advantages:

3 times cutting speed and about 30% more cutting efficiency than traditional slurry cutting.

Limited diamond clustering and stacking to ensure a clean cut with a consistent finish.

Consistent diamond spacing to ensure proper kerf removal and maximum cutting efficiency.

Expert plating to maximize product durability and strength.